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Reliability and Failure Analysis
Optical Microscope with Stitching Capability
Cascade Engineering’s lab is equipped with high powered Optical Imaging capability, an integral part of our Failure Analysis capabilities.
Features
Up to 1000x Magnification
DIC (Differential Interference Contrast), Darkfield/Brightfield and multiple light filtering capabilities
Equipped with an Olympus UC50 Camera capable of 4-24 fps & 5 MP resolution
Motorized Z stage for EFI (Extended Focal Imaging) and Stacked Imaging for improved image quality
System software supports automated Z Stack ‘Acquisition and Stitching Capability’ to enable better resolution & focus for failed parts and assemblies
Applications
The optical microscope is an excellent Non-destructive Failure analysis tool
Used for Inspection of IC components & solder joints on printed circuit boards. Helps in identifying typical defects like: Cracks, Opens, Bridging, Voiding, Misalignment, Missing joints etc…
Inspection of active and passive components, electronic components and hybrid modules
Stacked Imaging and Stitching capabilities provide high quality composite imaging of cracked, failed & fractured surfaces