A step by step approach highlighting the benefits of analyzing the modal response of electronic structures.
A comprehensive frequency domain mechanical shock analysis example to virtually quantify product shock durability.
A quick and effective example to virtually predict product reliability performance under random vibration loads.
An example of systematic fatigue analysis to compare different PCBA thicknesses for bending applications.
A detailed stress and damage modeling example of solder joint fatigue under temperature cycling loads highlighting the need for analysis to complement accelerated life tests in predicting long term reliability.