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Reliability and Failure Analysis
Scanning Electron Micrscope
Cascade Engineering’s lab is equipped with scanning electron microscopy capability, an integral part of our Failure Analysis capabilities.
Features
Resolution
High Vacuum mode: 3.0nm (30kV)
Low Vacuum mode: 4.0nm (30kV)
Acceleration Voltage: 0.3 to 30kV
Magnification: 5 to 300,000
EMI cage for AC noise reduction
Low vacuum mode for studying non-conductive samples
Energy Dispersive Spectrum for Elemental Analysis (Qualitative and Quantitative)
Elemental Mapping
Applications
Surface morphology imaging for all types of sample including metals, ceramics, polymers, etc…
Conductive and non-conductive samples
Together with cross section grinding/polishing equipments, SEM is a perfect tool to detect defects such voids, cracks, delaminations, in
IC components such as solder joints in PCBs.
Elemental analysis and elemental mapping using energy dispersive spectrum technique (EDS) in all types of sample