Reliability and Failure Analysis

Scanning Electron Micrscope

Cascade Engineering’s lab is equipped with scanning electron microscopy capability, an integral part of our Failure Analysis capabilities.


  • Resolution
    • High Vacuum mode: 3.0nm (30kV)
    • Low Vacuum mode: 4.0nm (30kV)
  • Acceleration Voltage: 0.3 to 30kV
  • Magnification: 5 to 300,000
  • EMI cage for AC noise reduction
  • Low vacuum mode for studying non-conductive samples
  • Energy Dispersive Spectrum for Elemental Analysis (Qualitative and Quantitative)
  • Elemental Mapping


  • Surface morphology imaging for all types of sample including metals, ceramics, polymers, etc…
  • Conductive and non-conductive samples
  • Together with cross section grinding/polishing equipments, SEM is a perfect tool to detect defects such voids, cracks, delaminations, in IC components such as solder joints in PCBs.
  • Elemental analysis and elemental mapping using energy dispersive spectrum technique (EDS) in all types of sample
  • Effective measurement tool for thin films, intermetallic layers, Solder joint geometry etc